Zhengzhou's first wafer packaging test production line put into operation

Jing Cheng Science Park Project is a major project of leap-forward development in our city. It mainly consists of three components of the R&D center headquarters building, packaging and testing center and wafer fab. The total investment is planned to be US$1 billion.

The commissioning of the wafer packaging test production line is an important node of the Jingcheng project, and the production value can reach 10 million US dollars per year. The commissioning of the wafer packaging test production line not only marked an important step in the success of the Jingcheng Science Park project, but also marked the successful start of the first wafer packaging test production line and semiconductor related industries in our city and even our province.

In his speech, deputy mayor Wang Qinghai stated that nurturing and expanding the high-tech industry is an important measure for the municipal party committee and government to implement the major strategy of industrial strong cities in recent years. The commissioning of the wafer encapsulation test production line of the Jingcheng Science Park not only plays an important role in the formation of the electronic information leading industry in the development zone and the processing zone, but also will greatly promote the transformation and upgrading of the city's industrial structure.

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